Contact LogicVisionSite Map
LogicVision SolutionsLogicVision ProductsCompanyLogicVision SupportInvestorsLogicVision News and Events

Success Stories

With LogicVision's embedded test solution, IC designers embed test functionality into a semiconductor design that is used during semiconductor production and throughout the useful life of the chip.

LogicVision solutions enable faster and more powerful semiconductors, reduce overall time-to-market, lower overall manufacturing costs, and enable system level test and field diagnostics.

Specific solutions we have provided are highlighted below.

"We carefully looked at available solutions in the market place and chose LogicVision's ETSerdes because it provides a purely digital, scaleable, RTL-based solution with sub-picosecond accuracy for testing our high speed I/Os with lane counts of up to 48.

"ETSerdes allows us to run a comprehensive suite of tests and characterizations on existing automatic test equipment. Additionally, having the test functionality embedded in our devices allows us, and our end customers, to run tests and error injection in the host system environment for field-level debug and diagnostics."

George Apostol
Vice President of Engineering
PLX. Technology

 

"With LogicVision’s embedded test, we had the Draco chip up and running within 45 minutes of receiving first silicon.

"This is unprecedented within Broadcom for this complexity of a device. Broadcom sees the embedded test methodology as a key component for high quality at-speed test that also enables rapid bring up of first time silicon, even for the most complex of devices.

"This combined with the diagnostic capabilities make embedded test essential in moving forward."

Martin Lund
Vice President and GM, Network Switched BU
Broadcom

 

"We have experienced great success in using LogicVision's embedded test solutions for both memory and logic test. Not only are we able to meet our stringent DPM (defects per million) requirements to satisfy our customer needs, we were also able to realize fast silicon bring-up times and achieve improved burn-in test quality. Because of these results, we're expanding the use of LogicVision's embedded logic and memory test solutions to other projects on a worldwide basis."

Shinichi Iwamoto,
Associate Vice President
Microcomputer Operations Unit
NEC Electronics

 

"We looked at the available 1149.6 solutions in the market and only LogicVision provided the complete solution we needed. Using LogicVision's solution we were able to deliver leading edge 1149.6 capability as required by our customers on time and within specifications."

Rick O'Connor
Chief Technology Officer
Tundra Semiconductor

 

"By using LogicVision's Silicon Insight product, PLX was able to easily characterize an embedded RAM in one of our latest devices. In addition to the advantages in cost and convenience of performing device diagnostics in the lab as opposed to on the production floor, we were able to complete the characterization of the RAM across multiple operating conditions and process corners within hours of the software installation."

Adrian Arozqueta
DFT Manager
PLX Technology

 

"The unique combination of LogicVision's Embedded Test technology and the Validator enables us to perform at-speed debug of our multi-million gate chips in days instead of weeks and pinpoint manufacturing yield hazards for rapid analysis and corrective action. We believe this fast, advanced debug capability will help us maintain a leading edge in the market by delivering robust, highly complex devices to our customers in a timely manner."

Alex Sinar
VP Operations
Zoran (formerly Oak Technology), TeraLogic Group

 

“LogicVision’s Memory BIST solution gives us the flexibility we need to effectively and efficiently test the different embedded memories in next-generation Rapport Kilocore Architecture devices. LogicVision offers a solution that allows us to hierarchically group and test different types and sizes of memories and allows us to select the best options for testing each one. LogicVision also provides us with the tools to easily integrate their BIST solutions into our design flow with a minimum of effort.”

Dr. Benjamin Levine
Director of Chip Development
Rapport, Inc.